I think, electromigration will still kill the chip earlier than individual device failures.
It was Intel is said to switched to cobalt wiring in latest node, and seems to be paying dearly for that. TSMC and others seem to go the conventional road and continued to perfect the salicide for smaller nodes without any issues.
Officially, Intel says 10nm has lithography problems. They did try a more aggressive node than TSMC's first "7nm", entirely using 193nm UV, and were the only company to attempt Self-Aligned Quadruple Patterning (SAQP) for the top metal layers.
It was Intel is said to switched to cobalt wiring in latest node, and seems to be paying dearly for that. TSMC and others seem to go the conventional road and continued to perfect the salicide for smaller nodes without any issues.